The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Jul. 25, 2016
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Brad C. Tischendorf, Minneapolis, MN (US);

John E. Kast, Hugo, MN (US);

Thomas P. Miltich, Otsego, MN (US);

Gordon O. Munns, Stacy, MN (US);

Randy S. Roles, Elk River, MN (US);

Craig L. Schmidt, Eagan, MN (US);

Joseph J. Viavattine, Vadnais Heights, MN (US);

Christian S. Nielsen, River Falls, WI (US);

Prabhakar A. Tamirisa, Brooklyn Park, MN (US);

Anthony M. Chasensky, St. Paul, MN (US);

Markus W. Reiterer, Plymouth, MN (US);

Chris J. Paidosh, Minneapolis, MN (US);

Reginald D. Robinson, Plymouth, MN (US);

Bernard Q. Li, Plymouth, MN (US);

Erik R. Scott, Maple Grove, MN (US);

Phillip C. Falkner, Minneapolis, MN (US);

Xuan K. Wei, Minnetonka, MN (US);

Eric H. Bonde, Minnetonka, MN (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/378 (2006.01); A61N 1/372 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01); A61B 17/00 (2006.01); A61N 1/02 (2006.01);
U.S. Cl.
CPC ...
A61B 17/00234 (2013.01); A61N 1/02 (2013.01); A61N 1/05 (2013.01); A61N 1/0551 (2013.01); A61N 1/36 (2013.01); A61N 1/3605 (2013.01); A61N 1/36007 (2013.01); A61N 1/36057 (2013.01); A61N 1/36067 (2013.01); A61N 1/36071 (2013.01); A61N 1/36139 (2013.01); A61N 1/3727 (2013.01); A61N 1/3754 (2013.01); A61N 1/3756 (2013.01); A61N 1/3787 (2013.01); A61N 1/37205 (2013.01); A61N 1/37223 (2013.01); A61N 1/37235 (2013.01); A61N 1/37247 (2013.01); A61N 1/37252 (2013.01); A61N 1/36021 (2013.01); A61N 1/36053 (2013.01); A61N 1/375 (2013.01); A61N 1/37211 (2013.01); F04C 2270/0421 (2013.01);
Abstract

An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.


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