The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Mar. 27, 2017
Applicant:

Dell Products, Lp, Round Rock, TX (US);

Inventors:

Robert W. Johnson, Round Rock, TX (US);

Robert Boyd Curtis, Georgetown, TX (US);

Assignee:

Dell Products, LP, Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20781 (2013.01); H05K 7/20736 (2013.01); H05K 7/20572 (2013.01); H05K 7/20636 (2013.01); H05K 7/20645 (2013.01); H05K 7/20772 (2013.01);
Abstract

A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.


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