The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Dec. 05, 2014
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Chunho Kim, Phoenix, AZ (US);

Songhua Shi, Chandler, AZ (US);

Mark S. Ricotta, Tempe, AZ (US);

Scott B. Sleeper, Apache Junction, AZ (US);

Yongqian Wang, Chandler, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); B29C 45/14336 (2013.01); B29C 45/14639 (2013.01); B29C 45/14836 (2013.01); H05K 3/28 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1572 (2013.01);
Abstract

During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.


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