The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Nov. 27, 2014
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Tomota Nagaura, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/48 (2006.01); H05K 3/20 (2006.01); B32B 15/01 (2006.01); C25D 1/04 (2006.01); C25D 7/06 (2006.01); B32B 15/20 (2006.01); C25D 5/14 (2006.01); C25D 3/40 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); C25D 3/16 (2006.01); C25D 3/38 (2006.01); C25D 3/58 (2006.01); C25D 9/08 (2006.01); C25D 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/205 (2013.01); B32B 15/01 (2013.01); B32B 15/20 (2013.01); C25D 1/04 (2013.01); C25D 3/40 (2013.01); C25D 5/14 (2013.01); C25D 5/48 (2013.01); C25D 7/0614 (2013.01); H05K 1/09 (2013.01); H05K 3/007 (2013.01); H05K 3/027 (2013.01); H05K 3/4038 (2013.01); B32B 2307/306 (2013.01); B32B 2307/538 (2013.01); B32B 2457/08 (2013.01); C25D 3/16 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); C25D 5/04 (2013.01); C25D 9/08 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01);
Abstract
A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.
Quick Actions:
Nagaura, Tomota. (2019). Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board (U.S. Patent No. 10201092). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10201092
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile