The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Aug. 29, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 1/18 (2006.01); H01R 4/58 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H01R 4/58 (2013.01); H05K 1/0213 (2013.01); H05K 1/115 (2013.01); H05K 3/341 (2013.01); H05K 7/142 (2013.01); H05K 1/145 (2013.01); H05K 3/3457 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10409 (2013.01);
Abstract
In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.