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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10201076 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Feb. 22, 2017

Coupler for proximity wireless communication

Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Jia Liu, Kawasaki Kanagawa, JP;

Motochika Okano, Tokyo, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Patterson & Sheridan, LLP

Primary Examiner:

Dean Takaoka

Int. Cl.
CPC ...
H01P 5/02 (2006.01); H05K 1/02 (2006.01); G06K 7/00 (2006.01); H01Q 1/24 (2006.01); H01Q 9/40 (2006.01); H01Q 5/50 (2015.01); H05K 1/18 (2006.01); H04W 4/80 (2018.01); H01Q 1/38 (2006.01); H01Q 13/10 (2006.01); H01Q 21/00 (2006.01); H01Q 21/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); G06K 7/00 (2013.01); H01Q 1/243 (2013.01); H01Q 5/50 (2015.01); H01Q 9/40 (2013.01); H01Q 1/38 (2013.01); H01Q 13/10 (2013.01); H01Q 21/0006 (2013.01); H01Q 21/08 (2013.01); H04W 4/80 (2018.02); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10636 (2013.01);
Abstract

A coupler for proximity wireless communication primarily based on an electric induction field generated therein, includes a substrate, a ground layer formed on a first region of the substrate and surrounding a second region of the substrate on three sides of the second region, a fourth side of the second region being defined by an edge of the substrate, and a coupling element electrically isolated from the ground layer and formed on the second region of the substrate. The coupling element includes a first portion that extends adjacent to and along the edge of the substrate and a second portion that is electrically connected to the first portion, extends inwardly from the edge of the substrate, and includes an inductor.

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