The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

May. 31, 2016
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventor:

Xuejun Sun, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2015.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01); H01L 25/00 (2006.01); H01Q 1/38 (2006.01); H05K 1/18 (2006.01); H01Q 1/24 (2006.01); H01Q 9/00 (2006.01); H01Q 9/04 (2006.01); H05K 1/16 (2006.01); H04B 7/0413 (2017.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H01L 25/00 (2013.01); H01Q 1/246 (2013.01); H01Q 1/38 (2013.01); H01Q 9/00 (2013.01); H01Q 9/0407 (2013.01); H04B 1/40 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H04B 7/0413 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A multi-layer Printed Circuit Board PCB and a wireless communication node are disclosed in the present invention. The multi-layer PCB which is to be assembled in the communication node may include multiple radio layers () on one side of the PCB and at least one antenna layer () on another side of the PCB. At least one radio component is to be mounted on a surface layer of the multiple radio layers and at least one antenna element is to be patched on a surface layer of the at least one antenna layer. In such way, legacy connectors from the filter unit respectively to the antenna unit and the radio unit in conventional PCB can be left out to decrease the size of the PCB.


Find Patent Forward Citations

Loading…