The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Feb. 29, 2016
Applicant:

Fujikura, Ltd., Tokyo, JP;

Inventors:

Takahiro Shimono, Sakura, JP;

Hideo Shiratani, Sakura, JP;

Kenichi Ishibashi, Sakura, JP;

Assignee:

FUJIKURA LTD., Koto-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); A61B 1/05 (2006.01); A61B 1/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2253 (2013.01); A61B 1/0011 (2013.01); A61B 1/051 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction moving away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which the rate of volumetric shrinkage in curing is 3% or more.


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