The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Dec. 07, 2014
Applicant:

Sanhe Laserconn Tech Co., Ltd., Sanhe, CN;

Inventors:

Yang Li, Beijing, CN;

Delong Li, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/18 (2006.01); H01S 5/183 (2006.01); H01S 5/40 (2006.01); H01S 5/42 (2006.01); H01S 5/00 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/18361 (2013.01); H01S 5/005 (2013.01); H01S 5/4043 (2013.01); H01S 5/423 (2013.01); H01S 5/426 (2013.01); H01S 5/0228 (2013.01); H01S 5/02252 (2013.01); H01S 5/02469 (2013.01); H01S 5/4012 (2013.01);
Abstract

Provided is a high-power semiconductor laser based on VCSEL, comprising a VCSEL laser module. The VCSEL laser module includes a VCSEL chip array () consisting of a plurality of VCSEL chips () and an inner wall reflection optical transmission device () which is arranged in front of a light emergent face of the VCSEL chip array (); and the light emergent face of the VCSEL chip array () is used for secondarily reflecting the reflected light reflected by a target object () and the inner wall reflection optical transmission device (). Also provided is a packaging structure for the high-power semiconductor laser. The VCSEL chip array () is packaged by an inwardly concave arc-shaped heat sink (), so that the purpose of converging the laser light beam near a centre position can be achieved.


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