The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Aug. 08, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Masumi Abe, Osaka, JP;

Toshifumi Ogata, Osaka, JP;

Naoki Tagami, Osaka, JP;

Toshiaki Kurachi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); F21V 13/02 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H05B 33/04 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); F21V 13/02 (2013.01); H01L 27/153 (2013.01); H01L 33/0095 (2013.01); H01L 33/20 (2013.01); H01L 33/62 (2013.01); H01L 51/5253 (2013.01); H05B 33/04 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.


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