The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Mar. 17, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Ordos Yuansheng Optoelectronics Co., Ltd., Ordos, Inner Mongolia, CN;

Inventors:

Fashun Li, Beijing, CN;

Fuyi Cui, Beijing, CN;

Xuefei Bai, Beijing, CN;

Shixin Ruan, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0012 (2013.01); H01L 27/3244 (2013.01); H01L 51/001 (2013.01); H01L 51/5246 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); H01L 2251/558 (2013.01);
Abstract

The present disclosure provides a display panel and a fabricating method thereof, and a display device. The fabricating method for the display panel includes forming a glass adhesive layer on a packaging region of a first substrate, forming an OLED device on a display region of the first substrate, and aligning the first substrate with a second substrate, and forming a sealing structure between the first substrate and the second substrate by irradiating the packaging region with laser. The fabricating method for the display panel according to an embodiment of the present disclosure avoids the occurrence of the phenomenon that the coated glass adhesive layer and the evaporated organic light emitting layer are offset during the subsequent packaging process, by fabricating the glass adhesive layer on the substrate for forming the OLED device, thereby the production efficiency of the overall packaging process is enhanced.


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