The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Sep. 29, 2016
Applicants:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Nichia Corporation, Anan-shi, JP;

Inventors:

Daisuke Matsuura, Tokyo, JP;

Takayuki Komai, Tokyo, JP;

Satoshi Shibasaki, Tokyo, JP;

Naoto Yamanaka, Tokyo, JP;

Masaaki Katsumata, Anan, JP;

Tomohiro Ikeda, Anan, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/502 (2013.01); H01L 33/508 (2013.01); H01L 33/56 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A substrate for a light emitting element including a resin substrate exhibiting flexibility and a metal wiring portion being formed on at least one surface side of the resin substrate via an adhesive layer, in which a reflective layer composed of a thermosetting resin is disposed between the resin substrate and the adhesive layer, in which the reflective layer contains a light reflective filler at 10% by mass or more and 85% by mass or less and has a reflectance to light at a wavelength of 450 nm of 80% or more.


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