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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10199414 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Apr. 25, 2017

Semiconductor device and electronic equipment

Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Shoji Kobayashi, Kanagawa, JP;

Yoshiharu Kudoh, Kanagawa, JP;

Takuya Sano, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Chip Law Group

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0224 (2006.01); H01L 31/0232 (2014.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 23/5386 (2013.01); H01L 27/1464 (2013.01); H01L 27/14603 (2013.01); H01L 27/14623 (2013.01); H01L 27/14636 (2013.01); H01L 27/14638 (2013.01); H01L 31/02005 (2013.01); H01L 31/02016 (2013.01); H01L 31/0224 (2013.01); H01L 31/02164 (2013.01); H01L 31/02327 (2013.01);
Abstract

The present technology relates to a semiconductor device and electronic equipment in which a semiconductor device that suppresses the occurrence of noise by a leakage of light can be provided. A semiconductor device is configured which includes a light-receiving element, an active element for signal processing, and a light shielding structurewhich is between the light-receiving elementand the active element to cover the active element and is formed of wiringsand. The semiconductor device further includes a first substrate on which the light-receiving element is formed, a second substrate on which the active element is formed, and a wiring layer which has a light shielding structure by the wirings which is formed on the second substrate, and in which the second substrate can be bonded to the first substrate through the wiring layer.

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