The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Aug. 15, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Wenming Ren, Beijing, CN;

Kai Wang, Beijing, CN;

Yinhu Huang, Beijing, CN;

Jong Won Moon, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1248 (2013.01); G02F 1/13394 (2013.01); G02F 1/133345 (2013.01); G02F 1/136227 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); H01L 27/124 (2013.01); G02F 2001/13396 (2013.01); G02F 2001/133354 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01);
Abstract

A display device and a manufacturing method thereof are provided, and the display device includes a color filter substrate and an array substrate which are cell-assembled, the array substrate includes a first base substrate, an organic insulating layer is formed on the first base substrate, and a via hole is formed in the organic insulating layer; the color filter substrate includes a second base substrate, a main spacer and a secondary spacer is formed on the second base substrate, an orthogonal projection of the secondary spacer is located in an orthogonal projection area of the via hole on the first base substrate, and an orthogonal projection of the main spacer is located outside of the orthogonal projection area of the via hole on the first base substrate.


Find Patent Forward Citations

Loading…