The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Dec. 22, 2015
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, CN;

Inventors:

Liping Liu, Beijing, CN;

Wenxiang Yin, Beijing, CN;

Yu Ai, Beijing, CN;

Junqi Han, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/1345 (2006.01); G02F 1/1362 (2006.01); G02F 1/155 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/1345 (2013.01); G02F 1/136286 (2013.01); G02F 1/155 (2013.01); H05K 1/189 (2013.01); H05K 2201/05 (2013.01);
Abstract

An electrical connection structure, an array substrate and a display device. The electrical connection structure includes a first electrical connection component, which includes: a conductive structure; an insulating layer covering the conductive structure, where at least one first via hole and at least one second via hole are disposed separately in the insulating layer, each first via hole and each second via hole expose a respective part of a surface of the conductive structure; and a conductive connection layer disposed on the insulating layer and covering the at least one first via hole and the at least one second via hole, where the conductive connection layer and the conductive structure are electrically connected with each other through the at least one first via hole and the at least one second via hole. The electrical connection structure can reduce undercut phenomena that occur at via holes in the insulating layer.


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