The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Jun. 23, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ingo Muri, Villach, AT;

Iris Moder, Villach, AT;

Oliver Hellmund, Neubiberg, DE;

Johannes Baumgartl, Riegersdorf, AT;

Annette Saenger, Villach, AT;

Barbara Eichinger, Villach, AT;

Doris Sommer, Villach, AT;

Jacob Tillmann Ludwig, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/94 (2006.01); H01L 29/76 (2006.01); H01L 27/06 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01);
Abstract

An integrated circuit device including a chip die having a first area with a first thickness surrounding a second area with a second thickness, the first thickness is greater than the second thickness, the chip die having a front-side and a back-side, at least one passive electrical component provided at least one of in or over the chip die in the first area on the front-side, and at least one active electrical component provided at least one of in or over the chip die in the second area on the front-side.


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