The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Mar. 14, 2017
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Markus Schmitt, Neubiberg, DE;

Armin Tilke, Dresden, DE;

Joachim Weyers, Hoehenkirchen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/535 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 23/482 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/16 (2006.01); H01L 29/861 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 23/4824 (2013.01); H01L 23/535 (2013.01); H01L 27/0292 (2013.01); H01L 29/04 (2013.01); H01L 29/0611 (2013.01); H01L 29/0634 (2013.01); H01L 29/0649 (2013.01); H01L 29/7396 (2013.01); H01L 29/7808 (2013.01); H01L 29/7811 (2013.01); H01L 29/0615 (2013.01); H01L 29/0638 (2013.01); H01L 29/16 (2013.01); H01L 29/7397 (2013.01); H01L 29/861 (2013.01); H01L 29/866 (2013.01);
Abstract

A semiconductor device includes a semiconductor body having opposite first and second surfaces. The semiconductor device further includes a transistor structure in the semiconductor body and a source contact structure overlapping the transistor structure. The source contact structure is electrically connected to source regions of the transistor structure. A gate contact structure is further provided, which has a part separated from the source contact structure by a longitudinal gap within a lateral plane. Gate interconnecting structures bridge the longitudinal gap and are electrically coupled between the gate contact structure and a gate electrode of the transistor structure. Electrostatic discharge protection structures bridge the longitudinal gap and are electrically coupled between the gate contact structure and the source contact structure. At least one of the gate interconnecting structures is between two of the electrostatic discharge protection structures along a length direction of the longitudinal gap.


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