The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Feb. 02, 2018
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/485 (2006.01); H01L 25/07 (2006.01); H01L 23/42 (2006.01); H01L 23/50 (2006.01); H01L 23/482 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/367 (2013.01); H01L 23/485 (2013.01); H01L 24/26 (2013.01); H01L 24/33 (2013.01); H01L 24/49 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/42 (2013.01); H01L 23/4821 (2013.01); H01L 23/50 (2013.01); H01L 24/41 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1425 (2013.01);
Abstract
According to one embodiment, a semiconductor module includes a first circuit component, a first connection member, and a first wire. The first circuit component includes a first substrate, a first conductive layer, a first switching device, and a first diode. The first substrate has an insulation property. The first connection member is provided on a first electrode of the first switching device and the fourth electrode of the first diode, and has a conductive property. The first wire connects the first conductive layer and the first connection member.