The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Mar. 17, 2017
Applicant:
SK Hynix Inc., Icheon-si and Gyeonggi-do, KR;
Inventor:
Yeon Ok Kim, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/58 (2006.01); H01L 23/31 (2006.01); H01L 23/32 (2006.01); H01L 23/522 (2006.01); H01L 23/525 (2006.01); H01L 23/00 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3107 (2013.01); H01L 23/32 (2013.01); H01L 23/522 (2013.01); H01L 23/585 (2013.01); H01L 25/0652 (2013.01); H01L 23/5256 (2013.01); H01L 24/16 (2013.01); H01L 27/0688 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A semiconductor package includes a first chip, a second chip stacked over the first chip and having a different size from the first chip, a first guard unit formed in an edge of a chip having a relatively small size of the first chip and the second chip, and a second guard unit formed in an edge of a chip having a relatively large size of the first chip and the second chip. The first guard unit includes an extension pad which expands the size of the chip having the relatively small size to the size of the chip having the relatively large size.