logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10199343 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Sep. 15, 2017

Ubm (under bump metal) electrode structure for radiation detector, radiation detector and production method thereof

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Makoto Mikami, Ibaraki, JP;

Kouji Murakami, Ibaraki, JP;

Akira Noda, Ibaraki, JP;

Assignee:

JX NIPPON MINING & METALS CORPORATION, Tokyo, JP;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); G01T 1/24 (2006.01); H01L 31/00 (2006.01); H01L 27/144 (2006.01); H01L 27/146 (2006.01); H01L 31/08 (2006.01); H01L 31/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); G01T 1/24 (2013.01); G01T 1/241 (2013.01); H01L 24/03 (2013.01); H01L 27/144 (2013.01); H01L 27/146 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14659 (2013.01); H01L 27/14661 (2013.01); H01L 27/14696 (2013.01); H01L 31/00 (2013.01); H01L 31/08 (2013.01); H01L 31/10 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05169 (2013.01); H01L 2924/10373 (2013.01); H01L 2924/10378 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/1433 (2013.01);
Abstract

An UBM electrode structure body for a radiation detector and a radiation detector arranged with the UBM electrode structure body are provided for suppressing peeling and having high electrode adhesion. In addition, a manufacturing method of an UBM electrode structure body for a radiation detector and a manufacturing method of a radiation detector using the UBM electrode structure body are provided in which peeling does not occur during UBM structure formation, a solder bonding process or bonding of a signal line to a Pt layer. The UBM electrode structure body for a radiation detector of the present invention is arranged with a CdTe substrate or CdZnTe substrate and a Pt electrode layer arranged on the CdTe substrate or CdZnTe substrate, adhesion of the Pt electrode layer with respect to the CdTe substrate or the CdZnTe substrate being 0.5 N/cm or more.

Find Patent Forward Citations

Loading…