The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Apr. 26, 2017
Applicant:

Lapis Semiconductor Co., Ltd., Yokohama, JP;

Inventor:

Hideki Masai, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 21/66 (2006.01); G01R 31/26 (2014.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 31/2644 (2013.01); H01L 22/14 (2013.01); H01L 23/525 (2013.01); H01L 23/5228 (2013.01); H01L 24/48 (2013.01); H01L 2224/48132 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device includes a signal processing circuit configured to generate an output signal, an output pad, an output line connecting the signal processing circuit to the output pad, the output signal from the signal processing circuit being output from the output pad through the output line, a shorting pad formed in the output line, a switch connected between the shorting pad and the output pad, and configured to connect the signal processing circuit to the output pad when the switch is on, and disconnect the signal processing circuit from the output pad when the switch is off, and a wiring line connecting the shorting pad to the output pad.


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