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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10199282 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Jun. 19, 2017

Inspection apparatus and method of manufacturing semiconductor device using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung-Won Park, Yongin-si, KR;

Jeong-Su Ha, Suwon-si, KR;

Sangbong Park, Yongin-si, KR;

Kwang Soo Kim, Pyeongtaek-si, KR;

Byeong Kyu Cha, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Stephen W Smoot

Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01N 21/95 (2006.01); G01N 21/88 (2006.01); G06T 7/00 (2017.01); H04N 7/18 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); G01N 21/8806 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G06T 7/0004 (2013.01); H01L 22/12 (2013.01); H04N 7/181 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/10056 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.

Find Patent Forward Citations

Park, Sung-Won. (2019). Inspection apparatus and method of manufacturing semiconductor device using the same (U.S. Patent No. 10199282). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10199282

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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