The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Dec. 28, 2015
Toho Engineering Co., Ltd., Yokkaichi-shi, JP;
Osaka University, Suita-shi, Osaka, JP;
Eisuke Suzuki, Yokkaichi, JP;
Kazuto Yamauchi, Suita, JP;
Tatsutoshi Suzuki, Yokkaichi, JP;
Daisuke Suzuki, Yokkaichi, JP;
OSAKA UNIVERSITY, Suita-Shi, Osaka, JP;
TOHO ENGINEERING CO., LTD., Yokkaichi-Shi, JP;
Abstract
A planarization processing device for polishing a substrate, such as a semiconductor wafer, includes a drive motor that rotates the substrate about a rotational axis. A support plate holds a pad for polishing the substrate such that the surface of the pad faces the surface of the substrate. The surface of the pad contains a catalyst, e.g., composed of a transition metal compound. A liquid that supports a catalytic reaction for polishing the substrate is supplied between the surfaces of the substrate and the pad. A reciprocating drive device causes the support plate to undergo reciprocating motion in a direction parallel to the surface of the pad by at least an amount that makes possible planarization of the substrate based on the catalytic reaction.