The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Mar. 25, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Jae Bum Cho, Suwon-Si, KR;

Hong Kyu Shin, Suwon-Si, KR;

Hyun Sub Oh, Suwon-Si, KR;

Jeong Oh Hong, Suwon-Si, KR;

Hee Sung Choi, Suwon-Si, KR;

Wan Suk Yang, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01); H01G 9/15 (2006.01); H01G 4/236 (2006.01); H01G 4/224 (2006.01); H01G 9/012 (2006.01); H01G 9/10 (2006.01); H01G 9/14 (2006.01); H01G 9/26 (2006.01);
U.S. Cl.
CPC ...
H01G 9/012 (2013.01); H01G 9/10 (2013.01); H01G 9/14 (2013.01); H01G 9/15 (2013.01); H01G 9/26 (2013.01);
Abstract

There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.


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