The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Jul. 01, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Seok Il Hong, Suwon-si, KR;

Jae Yeol Choi, Suwon-si, KR;

Jong Bong Lim, Suwon-si, KR;

Ju Hwan Yang, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/245 (2006.01); H01F 27/255 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 41/10 (2006.01); H01F 1/26 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 1/26 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/245 (2013.01); H01F 27/255 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 41/0233 (2013.01); H01F 41/041 (2013.01); H01F 41/042 (2013.01); H01F 41/046 (2013.01); H01F 41/10 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.


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