The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Jun. 30, 2015
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Wei Chen, Hsinchu, TW;

Cheng-Chang Lee, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD, Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H01F 27/28 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H01F 17/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0033 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/06 (2013.01); H05K 3/4069 (2013.01); H01F 2017/0093 (2013.01); H01F 2027/2819 (2013.01); H05K 1/0263 (2013.01); H05K 3/4614 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09563 (2013.01);
Abstract

For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively.


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