The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Feb. 26, 2016
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Akira Ichiki, Kanagawa-ken, JP;
Nozomu Tonoike, Kanagawa-ken, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G06F 3/047 (2006.01); G03F 7/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G03F 7/06 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/32 (2013.01); G06F 3/047 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01);
Abstract
An electroconductive film and a method for manufacturing the electroconductive film, having an insulating substrate and an electrode including a thin metal wire disposed on the surface of the insulating substrate, wherein the width of the thin metal wire varies, the difference between the maximum wire width and the minimum wire width of the thin metal wire is 20% to less than 75% of the average wire width of the thin metal wire, and the average wire width is 1-7 μm.