The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

May. 24, 2017
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Sonia Costantini, Missaglia Lecco, IT;

Marta Carminati, Casatenovo, IT;

Daniela Angela Luisa Gatti, Bussero, IT;

Laura Maria Castoldi, Abbiategrasso, IT;

Roberto Carminati, Piancogno, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/08 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G02B 26/10 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0833 (2013.01); B81B 3/0083 (2013.01); B81C 1/00714 (2013.01); G02B 26/105 (2013.01); B81B 2201/032 (2013.01); B81B 2201/042 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/058 (2013.01); B81C 2203/032 (2013.01);
Abstract

A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.


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