The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Mar. 24, 2017
Applicant:

Rosemount Aerospace Inc., Burnsville, MN (US);

Inventors:

Magdi A. Essawy, Lakeville, MN (US);

Ben Ping-Tao Fok, Rosemount, MN (US);

Marvin Gary Onken, Excelsior, MN (US);

Assignee:

Rosemount Aerospace, Inc., Burnsville, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 25/72 (2006.01); G01P 5/165 (2006.01); G01P 13/02 (2006.01); G01K 13/02 (2006.01); G01K 15/00 (2006.01); G01R 31/00 (2006.01); H05B 3/56 (2006.01); B64D 15/12 (2006.01); B64D 45/00 (2006.01); B64D 47/08 (2006.01); G01J 5/02 (2006.01); G01N 27/02 (2006.01); G01N 27/20 (2006.01); G01N 27/24 (2006.01); G01R 19/32 (2006.01); H05B 3/44 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
G01N 25/72 (2013.01); B64D 15/12 (2013.01); B64D 45/00 (2013.01); B64D 47/08 (2013.01); G01J 5/025 (2013.01); G01K 13/028 (2013.01); G01K 15/007 (2013.01); G01N 27/026 (2013.01); G01N 27/20 (2013.01); G01N 27/24 (2013.01); G01P 5/165 (2013.01); G01P 13/025 (2013.01); G01R 19/32 (2013.01); G01R 31/008 (2013.01); H05B 3/44 (2013.01); H05B 3/56 (2013.01); B64D 2045/0085 (2013.01); G01J 2005/0077 (2013.01); H05B 2214/02 (2013.01);
Abstract

A probe system is configured to receive thermal images of the probe system from a thermal imager and includes a heater and a control circuit. The heater includes a resistive heating element routed through the probe. An operational voltage is provided to the resistive heating element to provide heating for the probe. The control circuit is configured to provide the operational voltage and receive the thermal images from the thermal imager. The control circuit is further configured to monitor the thermal images over time and determine a remaining useful life of the probe system based upon the thermal images over time.


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