The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Jan. 28, 2015
Applicant:
Pac Tech—packing Technologies Gmbh, Nauen, DE;
Inventor:
Mohammad Hossein Azhdast, Berlin, DE;
Assignee:
PAC TECH—PACKING TECHNOLOGIES GMBH, Nauen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C23C 14/28 (2006.01); C23C 14/04 (2006.01); C23C 26/00 (2006.01); B22F 3/00 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
B82Y 30/00 (2013.01); B22F 3/003 (2013.01); B22F 7/04 (2013.01); B82Y 40/00 (2013.01); C23C 14/048 (2013.01); C23C 14/28 (2013.01); C23C 26/00 (2013.01); B22F 2007/042 (2013.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2301/255 (2013.01); B22F 2301/30 (2013.01); B22F 2302/45 (2013.01); B22F 2304/05 (2013.01); B22F 2999/00 (2013.01);
Abstract
An arrangement for applying metal nanoparticles onto a wafer or another substrate, is characterized by a metal or semiconductor part arranged in a liquid reservoir, laser or particle emitter for removing nanoparticles from the metal or semiconductor part in the liquid inside the liquid reservoir, and means for applying the removed metal particle containing liquid onto the substrate.