The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Oct. 28, 2014
Toyobo Co., Ltd., Osaka-shi, Osaka, JP;
Yukimi Yawata, Okayama, JP;
Toru Wada, Okayama, JP;
TOYOBO CO., LTD., Osaka-shi, JP;
Abstract
A method includes (i) preparing a printing original plate sheet having an uncured photosensitive resin layer on a surface thereof, wherein compressive strength of the uncured photosensitive resin layer at 25° C. is 1.0 to 3.0 kgf/cm; (ii) mounting the printing original plate sheet around a cylindrical support in such a manner that a starting terminal of the mounting and an ending terminal of the mounting are overlapped; and (iii) applying pressure to the overlapped area of the starting terminal of the mounting and the ending terminal of the mounting at a temperature range of 10 to 40 ° C. so as to pressure-bond the overlapped area. The method may further include, after the step (iii), a step (iv) for photo-curing the uncured photosensitive resin layer and may further comprise, after the step (iv), a step (v) for grinding, abrading and/or machining the overlapped area.