The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Dec. 30, 2014
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Hong-Jen Lai, Hsinchu, TW;
Ming-Sheng Leu, Zhudong Township, TW;
Tai-Sheng Chen, Kaohsiung, TW;
Wei-Tien Hsiao, Zhudong Township, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/28 (2006.01); C23C 16/02 (2006.01); C23C 14/02 (2006.01); B32B 15/08 (2006.01); A61L 27/56 (2006.01); C23C 14/20 (2006.01); C23C 16/06 (2006.01);
U.S. Cl.
CPC ...
B32B 3/28 (2013.01); A61L 27/56 (2013.01); B32B 15/08 (2013.01); C23C 14/028 (2013.01); C23C 14/20 (2013.01); C23C 16/0254 (2013.01); C23C 16/06 (2013.01); Y10T 428/1241 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/24545 (2015.01);
Abstract
A metal/polymer composite material is disclosed, wherein the metal/polymer composite material comprises a polymer base and a metal heat-dissipation layer. The heat-dissipation layer comprises a roughed surface with an isotropic surface roughness. The metal heat-dissipation conformally blankets over the roughed surface.