The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Oct. 03, 2014
Applicant:

Nok Corporation, Tokyo, JP;

Inventors:

Nobuyuki Umezaki, Aso, JP;

Hideto Nameki, Aso, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/42 (2006.01); F16J 15/328 (2016.01); B29D 99/00 (2010.01); F16J 15/10 (2006.01); F16J 15/02 (2006.01); B29C 45/26 (2006.01); B29L 31/26 (2006.01); B29L 31/00 (2006.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
B29C 33/42 (2013.01); B29C 45/26 (2013.01); B29D 99/0053 (2013.01); F16J 15/022 (2013.01); F16J 15/108 (2013.01); F16J 15/328 (2013.01); B29C 43/021 (2013.01); B29L 2031/265 (2013.01); B29L 2031/711 (2013.01);
Abstract

The object of the present invention is to provide a gasket forming mold with a structure in which curling of the reversing section of the gasket molding does not occur easily. To achieve said object, the forming mold for integrally forming an endless shaped gasket has forming grooves as cavities in the parting surfaces of the forming mold and the forming grooves have a reversing section in a part thereof. The reversing section has two linear portions and the ends of the two linear portions are connected by an arc-shaped curved section. The two linear portions are arranged at literally-symmetrical positions and are arranged so that a distance therebetween is enlarged little by little from one end toward the other. The ends where said distance is enlarged are connected by the circular arc-shaped curved section.


Find Patent Forward Citations

Loading…