The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Aug. 26, 2016
Applicant:
Tanaka Denshi Kogyo K.k., Kanzaki-gun, Saga-ken, JP;
Inventors:
Hiroyuki Amano, Saga-ken, JP;
Somei Yarita, Saga-ken, JP;
Yusuke Sakita, Saga-ken, JP;
Yuki Antoku, Saga-ken, JP;
Wei Chen, Saga-ken, JP;
Assignee:
TANAKA DENSHI KOGYO K.K., Kanzaki-Gun, Saga-Ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21C 1/02 (2006.01); B23K 35/02 (2006.01); C22C 9/00 (2006.01); C22C 9/06 (2006.01); B23K 35/30 (2006.01); B32B 15/01 (2006.01); C22C 5/02 (2006.01); C22C 5/04 (2006.01); C22F 1/08 (2006.01); C22F 1/14 (2006.01); C23C 14/16 (2006.01); C23C 14/35 (2006.01); C23C 26/00 (2006.01); C25D 3/50 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0227 (2013.01); B21C 1/02 (2013.01); B23K 35/302 (2013.01); B32B 15/018 (2013.01); C22C 5/02 (2013.01); C22C 5/04 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); C22F 1/08 (2013.01); C22F 1/14 (2013.01); C23C 14/165 (2013.01); C23C 14/35 (2013.01); C23C 26/00 (2013.01); C25D 3/50 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/45 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/10253 (2013.01);
Abstract
A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.