The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Apr. 11, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Jin-man Park, Seoul, KR;
Keum-hwan Park, Seoul, KR;
Eun-soo Park, Suwon-si, KR;
Ju-ho Lee, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01J 37/34 (2006.01); B22D 23/00 (2006.01); C23C 14/34 (2006.01); C22C 45/08 (2006.01); C22C 45/02 (2006.01); C23C 14/14 (2006.01); C22C 45/04 (2006.01); C23C 30/00 (2006.01); C22C 45/10 (2006.01); C22C 45/00 (2006.01); C23C 14/20 (2006.01); B29C 43/18 (2006.01); B29K 79/00 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
B22D 23/003 (2013.01); C22C 45/001 (2013.01); C22C 45/008 (2013.01); C22C 45/02 (2013.01); C22C 45/04 (2013.01); C22C 45/08 (2013.01); C22C 45/10 (2013.01); C23C 14/14 (2013.01); C23C 14/205 (2013.01); C23C 14/34 (2013.01); C23C 14/3414 (2013.01); C23C 30/00 (2013.01); H01J 37/3414 (2013.01); H05K 9/0024 (2013.01); H05K 9/0043 (2013.01); H05K 9/0084 (2013.01); B29C 43/18 (2013.01); B29K 2079/08 (2013.01); B29K 2705/00 (2013.01); B29K 2995/0011 (2013.01); C22C 45/00 (2013.01); H01J 2237/081 (2013.01); H01J 2237/332 (2013.01); Y10T 428/12556 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12812 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/265 (2015.01);
Abstract
An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.