The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Jun. 09, 2017
Applicant:

Spine Wave, Inc., Shelton, CT (US);

Inventors:

Michael Landry, Austin, TX (US);

Steven J. Wysocki, Stratford, CT (US);

Assignee:

SPINE WAVE, INC., Shelton, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61F 2/44 (2006.01); A61F 2/46 (2006.01); A61B 17/02 (2006.01); A61F 2/30 (2006.01);
U.S. Cl.
CPC ...
A61F 2/447 (2013.01); A61F 2/442 (2013.01); A61F 2/4425 (2013.01); A61F 2/4455 (2013.01); A61F 2/4465 (2013.01); A61F 2/4611 (2013.01); A61B 2017/0256 (2013.01); A61F 2002/3052 (2013.01); A61F 2002/30383 (2013.01); A61F 2002/30476 (2013.01); A61F 2002/30492 (2013.01); A61F 2002/30556 (2013.01); A61F 2002/30599 (2013.01); A61F 2002/30601 (2013.01); A61F 2002/30904 (2013.01); A61F 2002/448 (2013.01); A61F 2220/0025 (2013.01); A61F 2250/0009 (2013.01); A61F 2250/0063 (2013.01);
Abstract

An expandable interbody fusion device includes superior and inferior plates that are configured to receive a sequentially inserted stack of expansion members or wafers. The superior and inferior plates include features that at least initially interlock the two plates until the superior plate is dislodged by pressure from the growing wafer stack. The wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. Each wafer also includes features that interlock with the inferior plate until the wafer id dislodged by sequential introduction of another wafer.


Find Patent Forward Citations

Loading…