The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Jun. 01, 2016
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); A61B 5/00 (2006.01); H05K 1/02 (2006.01); H05K 3/20 (2006.01); H05K 3/22 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
A61B 5/6802 (2013.01); H05K 1/02 (2013.01); H05K 1/028 (2013.01); H05K 1/189 (2013.01); H05K 3/20 (2013.01); H05K 3/22 (2013.01);
Abstract
A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.