The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Jul. 20, 2017
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0061 (2013.01); H05K 1/0206 (2013.01); H05K 1/09 (2013.01); H05K 3/025 (2013.01); H05K 3/341 (2013.01); H05K 3/4611 (2013.01); H05K 3/4682 (2013.01); H05K 1/0203 (2013.01); H05K 1/189 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0353 (2013.01);
Abstract
Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.