The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Feb. 27, 2017
Applicant:

International Business Machines Corporation;

Inventors:

Timothy J. Chainer, Armonk, NY (US);

Michael Gaynes, Armonk, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); B32B 37/12 (2006.01); B32B 7/14 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); B32B 3/266 (2013.01); B32B 7/14 (2013.01); B32B 37/1292 (2013.01); H01L 21/4871 (2013.01); H01L 23/373 (2013.01); H01L 23/49838 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/03 (2013.01); B32B 2255/26 (2013.01); B32B 2307/302 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); H05K 2201/066 (2013.01);
Abstract

A method comprises applying an adhesive to a first substrate and a second substrate to secure the first substrate to the second substrate. The adhesive extends in a plane on one side of an interposer that also extends in the plane, and is contiguous with the adhesive. The interposer comprises openings to enable flow of adhesive through the openings to form adhesive bond areas on one of the substrates where the areas substantially conform to the openings and lie adjacent to adhesive free areas. The adhesive substantially covers the other of the substrates so that the bond areas produce regions of reduced adhesive strength to the one substrate compared to the bond strength of the adhesive to the other substrate. Adjusting opening sizes adjusts area bond strengths. One substrate may comprise a VTM, the other a heat spreader, and the adhesive, a TIM. An article of manufacture comprises the substrate-adhesive-interposer-adhesive-substrate layers.


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