The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Dec. 09, 2015
Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Masayuki Inoue, Mie, JP;
AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.