The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Apr. 30, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tetsuya Ueda, Tokyo, JP;

Takahiko Anan, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 7/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 1/16 (2013.01); H05K 7/183 (2013.01); H05K 2201/10681 (2013.01); H05K 2203/082 (2013.01); H05K 2203/088 (2013.01);
Abstract

Provided is a chip mounter, an electronic circuit substrate, and a power module, where the chip mounter prevents foreign substances from a chip-mounter installation environment, dust generated from members, and dust generated from the chip mounter, thereby preventing failures caused by the foreign substances. The chip mounter takes out a chip component accommodated in a packing tape. The packing tape has a pocket. The pocket has a bottom surface provided with a through hole. The chip mounter includes a tape travelling rail, a sucking-and-mounting arm, and a cavity cleaning mechanism. The cavity cleaning mechanism includes an intake hole disposed upstream of a suction point, in a location of the tape travelling rail, on which the carrier tape with a cover tape attached thereto travels so as to overlap the through hole. The cavity cleaning mechanism takes in the inside of the pocket through the intake hole and the through hole.


Find Patent Forward Citations

Loading…