The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Oct. 07, 2015
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Morten Ginnerup, Kgs. Lyngby, DK;

Pirmin Hermann Otto Rombach, Kongens Lyngby, DK;

Jan Tue Ravnkilde, Hedehusene, DK;

Dennis Mortensen, Frederiksberg C, DK;

Kurt Rasmussen, Herlev, DK;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/04 (2006.01); H04R 1/08 (2006.01); H04R 1/28 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/04 (2013.01); H04R 1/083 (2013.01); H04R 1/28 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01);
Abstract

A package for a top port microphone with an enlarged back volume. The package includes on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.


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