The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Jun. 29, 2016
Applicant:
Tdk Corporation, Tokyo, JP;
Inventor:
Wolfgang Pahl, München, DE;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 1/04 (2006.01); H04R 1/28 (2006.01); H04R 1/34 (2006.01); B29C 44/12 (2006.01); B29C 44/18 (2006.01); B29C 44/34 (2006.01); B29C 65/48 (2006.01); B29L 31/34 (2006.01); H04R 19/00 (2006.01); H04R 19/01 (2006.01); H04R 19/04 (2006.01); B29K 101/12 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); B29C 44/1228 (2013.01); B29C 44/3415 (2013.01); B29C 65/48 (2013.01); H04R 1/021 (2013.01); H04R 1/2811 (2013.01); H04R 1/34 (2013.01); H04R 19/005 (2013.01); H04R 19/016 (2013.01); H04R 19/04 (2013.01); B29C 44/188 (2013.01); B29K 2101/12 (2013.01); B29K 2105/046 (2013.01); B29K 2995/0097 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3481 (2013.01); H04R 2201/003 (2013.01); H04R 2201/029 (2013.01);
Abstract
A microphone having a housing including a bottom part and an upper part, and a transducer element which is arranged in the housing and is electrically and mechanically connected to the bottom part. For stress-free mounting of the transducer element, a flexible connecting element is proposed, which is pliable and/or compressible, is arranged between the transducer element and the upper part, and connects the transducer element to the upper part. The connecting element comprises a plastic, in which gas bubbles are distributed, the gas bubbles having a volume fraction of between 50 and 98% in the connecting element.