The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Dec. 29, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Nan-Wei Gong, Cambridge, MA (US);

Tobias Rick, Mountain View, CA (US);

Arun Rakesh Yoganandan, San Francisco, CA (US);

Henry Holtzman, San Francisco, CA (US);

Jae Woo Chung, San Francisco, CA (US);

Kumi Akiyoshi, San Francisco, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); H03K 17/955 (2006.01); G06F 1/16 (2006.01); G06F 3/01 (2006.01); G06F 3/0346 (2013.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H03K 17/955 (2013.01); G06F 1/169 (2013.01); G06F 1/1616 (2013.01); G06F 3/017 (2013.01); G06F 3/0346 (2013.01); H05K 1/189 (2013.01); G06F 3/044 (2013.01); H03K 2217/96015 (2013.01); H05K 1/028 (2013.01); H05K 2201/053 (2013.01); H05K 2201/10151 (2013.01);
Abstract

In one aspect, a modular sensing apparatus will be described. The modular sensing apparatus includes a flexible substrate and multiple sensors. The flexible substrate is reconfigurable into different shapes that conform to differently shaped structures. The multiple sensors are positioned on the substrate. Various embodiments relate to software, devices and/or systems that involve or communicate with the modular sensing apparatus.


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