The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Jan. 03, 2018
Applicant:
Nuvotronics, Inc, Radford, VA (US);
Inventors:
Jean-Marc Rollin, Chapel Hill, NC (US);
J. Robert Reid, Billerica, MA (US);
David Sherrer, Cary, NC (US);
Will Stacy, Blacksburg, VA (US);
Ken Vanhille, Cary, NC (US);
J. Marcus Oliver, Durham, NC (US);
Tim Smith, Durham, NC (US);
Assignee:
NUVOTRONICS, INC, Radford, VA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/02 (2006.01); H01P 3/06 (2006.01); H01P 1/04 (2006.01); H01P 3/00 (2006.01); H01P 3/18 (2006.01); H01P 5/107 (2006.01); H05K 1/00 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/02 (2013.01); H01P 1/045 (2013.01); H01P 3/00 (2013.01); H01P 3/06 (2013.01); H01P 3/18 (2013.01); H01P 5/107 (2013.01); H01P 11/001 (2013.01); H05K 1/00 (2013.01);
Abstract
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.