The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Jan. 24, 2017
Applicant:

Nutech Ventures, Lincoln, NE (US);

Inventors:

Jinsong Huang, Lincoln, NE (US);

Qingfeng Dong, Lincoln, NE (US);

Yuchuan Shao, Lincoln, NE (US);

Assignee:

NUtech Ventures, Lincoln, NE (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/20 (2006.01); H01L 51/42 (2006.01); H01L 51/44 (2006.01); H01L 51/00 (2006.01); H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/424 (2013.01); H01G 9/0029 (2013.01); H01G 9/2009 (2013.01); H01L 51/0012 (2013.01); H01L 51/0021 (2013.01); H01L 51/0026 (2013.01); H01L 51/0028 (2013.01); H01L 51/4213 (2013.01); H01L 51/442 (2013.01); H01L 51/0035 (2013.01); H01L 51/0037 (2013.01); H01L 51/0047 (2013.01); H01L 51/0077 (2013.01); Y02E 10/549 (2013.01);
Abstract

Continuous processes for fabricating a perovskite device are described that include forming a perovskite layer or film on a substrate using a linear deposition device, and optionally using a conductive tape lamination process to form an anode or a cathode layer on the perovskite device.


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