The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Nov. 16, 2017
Advanced Optoelectronic Technology, Inc., Hsinchu, Hsien, TW;
Shih-Chuan Lin, Hsinchu, TW;
Tsung-Han Chiang, Hsinchu, TW;
Chun-Yao Lin, Hsinchu, TW;
Chao-Ming Huang, Hsinchu, TW;
Hsiu-Ling Hung, Hsinchu, TW;
Tzu-Chien Hung, Hsinchu, TW;
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC, Hsinchu Hsien, TW;
Abstract
A light emitting diode comprises a light emitting diode chip and a packaging layer. The light emitting diode chip comprises a N-semiconductor layer, a light active layer, and a P-semiconductor layer arranged from a bottom to a top in that sequence, a first electrode, and a second electrode. The first electrode is formed on the P-semiconductor layer. The second electrode is formed on the N-semiconductor layer. The packaging layer covers the light emitting diode chip, and exposes the N-semiconductor layer, the first electrode, and the second electrode. The packaging layer has a through hole separated from a periphery of the light emitting diode chip. A conductive substrate fills the through hole. A first conductive layer is electrically connected to the first electrode and the conductive substrate. The disclosure also provides a method for manufacturing a light emitting diode.