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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10192993 B1

PDFFull Text
Date of Patent:
Jan. 29, 2019

Filed:

Sep. 14, 2017

Thin film transfer, manufacturing method thereof, array substrate and manufacturing method thereof

Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Ordos Yuansheng Optoelectronics Co., Ltd., Inner Mongolia, CN;

Inventors:

Yanwei Ren, Beijing, CN;

Chaochao Sun, Beijing, CN;

Kunpeng Zhang, Beijing, CN;

Yezhou Fang, Beijing, CN;

Jingyi Xu, Beijing, CN;

Assignees:

BOE TECHNOLOGY GROUP CO., LTD., , CN;

ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., , CN;

Attorney:

Brooks Kushman P.C.

Primary Examiner:

Dung Le

Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); G03F 7/30 (2006.01); H01L 27/32 (2006.01); G02F 1/1368 (2006.01); G02F 1/1343 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78633 (2013.01); H01L 27/1222 (2013.01); H01L 27/1274 (2013.01); H01L 27/1288 (2013.01); H01L 29/66757 (2013.01); H01L 29/78603 (2013.01); H01L 29/78675 (2013.01); G02F 1/1368 (2013.01); G02F 1/134363 (2013.01); G02F 2202/103 (2013.01); G02F 2202/104 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); H01L 27/1251 (2013.01); H01L 27/322 (2013.01); H01L 27/3262 (2013.01); H01L 27/3272 (2013.01);
Abstract

The present disclosure provides a TFT, a manufacturing method thereof, an array substrate and a manufacturing method thereof. The TFT includes a substrate, a p-Si active layer arranged on the substrate, and a first a-Si layer arranged on a surface of the p-Si active layer at a side adjacent to the substrate. An orthogonal projection of the p-Si active layer onto the substrate at least partially overlaps an orthogonal projection of the first a-Si layer onto the substrate.

Find Patent Forward Citations

Ren, Yanwei. (2019). Thin film transfer, manufacturing method thereof, array substrate and manufacturing method thereof (U.S. Patent No. 10192993). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10192993

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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