The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Mar. 06, 2018
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Takashi Yokoyama, Kanagawa, JP;
Taku Umebayashi, Tokyo, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 23/48 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 27/06 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); H01L 43/10 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/228 (2013.01); H01L 21/76898 (2013.01); H01L 21/84 (2013.01); H01L 21/845 (2013.01); H01L 23/481 (2013.01); H01L 27/0694 (2013.01); H01L 27/1203 (2013.01); H01L 27/1211 (2013.01); H01L 29/785 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01); H01L 21/76897 (2013.01); H01L 29/7833 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device including a semiconductor substrate with a first surface and a second surface facing each other, the semiconductor substrate having an element region in which a transistor is provided on the first surface, and a separation region in which an element separating layer surrounding the element region is provided; a contact plug extending from the first surface to the second surface, in the element region of the semiconductor substrate; and an insulating film covering a periphery of the contact plug.