The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Jun. 08, 2017
Applicant:

Visera Technologies Company Limited, Hsin-Chu, TW;

Inventors:

Tzu-Wei Huang, Zhubei, TW;

Ji-Hong Lin, Kaohsiung, TW;

Huang-Jen Chen, Keelung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 27/146 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14627 (2013.01); H01L 27/1462 (2013.01); H01L 27/14621 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 27/14636 (2013.01);
Abstract

Methods of fabricating solid-state imaging devices having a flat microlens array are provided. The method includes providing a semiconductor substrate having a plurality of photoelectric conversion elements. A color filter layer is formed above the semiconductor substrate. A lens material layer is formed on the color filter layer. A hard mask having a lens-shaped pattern is formed on the lens material layer. The method further includes etching both the hard mask and the lens material layer to form a microlens with a flat top surface that is formed from the lens material layer, and to leave a portion of the hard mask on the flat top surface of the microlens. The method also includes removing the portion of the hard mask that remains on the microlens.


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